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1 05154.r7 9/08 www.protekdevices.com *u.s. patent no. des. ?d456,367s? flip chip array p0404fc3.3c* thru p0404fc36c* 05154 applications ? cellular phones ? mcm boards ? wireless communication circuits ? ir leds ? smart & pcmcia cards iec compatibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns features ? esd protection > 25 kilovolts ? available in voltages ranging from 3.3v to 36v ? 250 watts peak pulse power per line (tp = 8/20s) ? bidirectional configuration & monolithic structure ? protects 1 to 3 lines ? rohs compliant mechanical characteristics ? standard eia chip size: 0404 ? weight 0.73 milligrams (approximate) ? available in lead-free plating ? solder reflow temperature: lead-free - sn/ag/cu, 96/3.5/0.5: 260-270c ? flammability rating ul 94v-0 ? 8mm plastic & paper tape and reel per eia standard 481 ? device marking on reel ? top contacts: solder bump 0.004? in height (nominal) pin configuration 0402 chip shown
2 05154.r7 9/08 www.protekdevices.com *u.s. patent no. des. ?d456,367s? p0404fc3.3c* thru p0404fc36c* device characteristics operating temperature symbol v alue -55 to 150 c c -55 to 150 units t a t stg parameter storage temperature peak pulse power (tp = 8/20s) - see figure 1 p pp 250 watts maximum ratings @ 25c unless otherwise specified electrical characteristics per line @ 25c unless otherwise specified part number (see note 1) minimum breakdown voltage @ 1ma v (br) volts maximum clamping voltage (see fig. 2) @ i p = 1a v c volts maximum clamping voltage (see fig. 2) @8/20s v c @ i pp typical capacitance @0v, 1 mhz c pf p0404fc3.3c p0404fc05c p0404fc08c p0404fc12c p0404fc15c p0404fc24c p0404fc36c 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 11.0 13.2 19.8 25.4 37.2 60.0 12.5v @ 20a 14.7v @ 17a 19.2v @ 13a 29.7v @ 9.0a 35.7v @ 7.0a 55.0v @ 5.0a 70.0v @ 3.0a 150 100 75 50 40 30 25 maximum leakage current (see note 2) @v wm i d a 75* 10** 10*** 1 1 1 1 rated stand-off voltage v wm volts note 1: all devices are bidirectional. electrical characteristics apply in both directions. note 2: *maximum leakage current < 5a @ 2.8v. **maximum leakage current <500na @ 3.3v. ***maximum leakage current <200na @ 5v. 0 5 10 15 20 25 30 t - time - s 0 20 40 60 80 100 120 i pp - peak pulse current - % of i pp test waveform parameters t f = 8s t d = 20s t f peak value i pp e -t t d = t i pp /2 figure 2 pulse wave form 0.01 1 10 100 1,000 10,000 t d - pulse duration - s 10 100 1,000 10,000 p pp - peak pulse current - watts figure 1 peak pulse power vs pulse time 250w, 8/20s waveform
3 05154.r7 9/08 www.protekdevices.com *u.s. patent no. des. ?d456,367s? p0404fc3.3c* thru p0404fc36c* graphs 0 5 10 15 20 v c - clamping voltage - volts 0 4 8 12 14 figure 5 typical clamping voltage vs peak pulse current for p0404fc05c 10 6 2 i pp - peak pulse current - amps esd test pulse - 25 kilovolt, 1/30ns (waveshape) figure 4 overshoot & clamping voltage for p0404fc05c 5 volts per division -5 5 15 25 35 0 25 50 75 100 125 150 t a - ambient temperature - c 20 40 60 80 100 % of rated power peak pulse power 8/20s average power figure 3 power derating curve 0
4 05154.r7 9/08 www.protekdevices.com *u.s. patent no. des. ?d456,367s? p0404fc3.3c* thru p0404fc36c* application information

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,-+ '" ramp-up ramp-down ramp-up 15 seconds solder time 15-20 seconds ramp-down t s - preheat t smax t smin t l t 25c to peak 30-60 seconds temperature - c t p 155 140 0.275mm round non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening (laser cut, 5% tapered walls) solder paste type pad protective finish tolerance - edge to corner ball solder ball side coplanarity maximum dwell time above liquidous (183c) soldering maximum temperature printed circuit board recommendations parameter value requirements temperature: t p for lead-free (snagcu): 260-270c t p for tin-lead: 240-245c preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. recommended non-solder mask defined pad illustration non-solder mask defined pad 0.275mm dia. solder mask opening 0.325mm dia. solder stencil opening 0.330mm dia.
5 05154.r7 9/08 www.protekdevices.com *u.s. patent no. des. ?d456,367s? p0404fc3.3c* thru p0404fc36c* 0404 package outline & dimensions a b c e f g h i 0.56 nom 0.86 nom 1.0 0.02 0.15 sq 1.0 0.0254 0.15 nom 0.127 max 0.076 min 0.406 nom 0.022 nom 0.034 nom 0.039 0.001 0.006 sq 0.039 0.001 0.006 nom 0.005 max 0.003 min 0.016 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). package outline mounting pad layout - option 1 a c d e f g h i 0.51 0.30 0.46 0.20 0.15 sq 0.71 0.99 0.51 note: 1. preferred: using 0.1mm (0.004?) stencil. 0.020 0.012 0.018 0.008 0.006 sq 0.028 0.039 0.020 pad dimensions dim millimeters inches ! !./ 01!/ -
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6 05154.r7 9/08 www.protekdevices.com *u.s. patent no. des. ?d456,367s? p0404fc3.3c* thru p0404fc36c* 0404 package outline & dimensions copyright ? prot ek devices 2007 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility with respect to the selection or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com a f g h i 0.51 0.15 sq 0.71 0.99 0.51 0.020 0.006 sq 0.028 0.039 0.020 dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). 3. preferred: using 0.1mm (0.004?) stencil. mounting pad layout - option 2 ! !./ 01!/ -
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7 tape & reel ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia 481. 2. 8mm plastic tape: 7 inch reels - 5,000 pieces per reel. orderingsuffix: -t75-1, i.e., p0404fc05c-t75-1 . 3. 8mm paper tape: 7 inch reels - 10,000 pieces per reel. ordering suffix: -t710-2, i.e., p0404fc05c-t710-2 . 4. suffix - lf = lead-free, i.e., p0404fc05c-lf-t710-2 . tape & reel orientation note: 1. top view of tape. solder bumps are face down in tape package. dual die - 0404 laser orientation line outline & dimensions: rev 4 - 9/04, 06022

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